LED chip package structure with high-efficiency light-emitting effect and method of packaging the same

ABSTRACT

An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.

RELATED APPLICATIONS

This application is a Divisional patent application of co-pendingapplication Ser. No. 11/898,378, filed on 12 Sep. 2007. The entiredisclosure of the prior application, Ser. No. 11/898,378, from which anoath or declaration is supplied, is considered a part of the disclosureof the accompanying Divisional application and is hereby incorporated byreference.

BACKGROUND OF THE INVENTION

1. Field of The Invention

The present invention relates to an LED chip package structure and amethod of packaging the same, and particularly relates to a light socketstructure for an LED chip package structure that emits light highlyefficiently and a method of packaging the same.

2. Description of the Related Art

Referring to FIG. 1, a known first method for packaging LED chips isshown. The known first method includes: providing a plurality ofpackaged LEDs that have been packaged (S800); providing a strippedsubstrate body that has a positive electrode trace and a negativeelectrode trace (S802); and then, arranging each packaged LED on thestripped substrate body in sequence and electrically connecting apositive electrode side and a negative electrode side of each packagedLED with the positive electrode trace and the negative electrode traceof the substrate body (S804).

Referring to FIG. 2, a known second method for packaging LED chips isshown. The known second method includes: providing a stripped substratebody that has a positive electrode trace and a negative electrode trace(S900); arranging a plurality of LED chips on the stripped substratebody in sequence and electrically connecting a positive electrode sideand a negative electrode side of each LED chip with the positiveelectrode trace and the negative electrode trace of the substrate body(S902); and then, covering a stripped package colloid on the substratebody and the LED chips to form a light bar with a strippedlight-emitting area (S904).

However, with regard to the known first method, each packaged LED needsto be firstly cut from an entire LED package structure, and then eachpackaged LED is arranged on the stripped substrate body via SMT process.Hence, the known first packaging process is time-consuming. Moreover,because the fluorescent colloids 4 a are separated from each other, adark band is easily produced between the two fluorescent colloids 4 aand the two LEDs 2 a. Hence, the known LED package structure does notoffer a good display for users. Moreover, because the package colloidsof the packaged LEDs are separated from each other, a dark band iseasily produced between each two package colloids and each two packagedLEDs. Hence, the known first LED package structure does not offer a gooddisplay for users.

With regard to the known second method, because the light bar producesthe stripped light-emitting area, no dark band is produced. However, thetriggered area of the stripped package colloid is not uniform, so thelight-emitting efficiency of the light bar is not good. In other words,one partial package area of the stripped package colloid close to theLED chips generates a stronger triggered light, and the other partialpackage area of the stripped package colloid separated from the LEDchips generates a weaker triggered light.

Referring to FIG. 3, an LED chip D is used to generate lateral projectedlight as a lateral light source that is applied to a light-guiding boardM of a monitor of a notebook. Because the light-guiding board M of themonitor is very thin, a length 11 of a base Si needs to be shortened. Inother words, the length 11 of the base Si is very short, the LED chip Dcan not get good heat-dissipating effect (the length 11 of the base Siis limited by the thickness of light-guiding board M). Hence, the LEDchip D is damaged easily due to overheat.

SUMMARY OF THE INVENTION

The present invention provides an LED chip package structure and amethod of packaging the same. When the LED chip package structure of thepresent invention lights up, the LED chip package structure generates aseries of light-generating areas on a colloid unit. Because the seriesof light-generating areas is continuous, no dark bands are producedbetween each two LED chips and no light decay in the present invention.Furthermore, because the LED chips are arranged on a substrate body viaan adhesive or a hot pressing method, the process for the LED chippackage structure is simple and less time is needed for themanufacturing process. Furthermore, the LED chip package structure canbe applied to any type of light source such as a back light module, adecorative lamp, a lighting lamp, or a scanner.

Moreover, the LED chip package structure of the present can be used invertical state due to the special hot pressing method. Hence, the LEDchip package structure of the present invention not only has a goodheat-dissipating effect, but also can be applied to a thin casing.

A first aspect of the present invention is a method of packaging LEDchips with high-efficiency light-emitting effect. The method includes:

providing a substrate unit, wherein the substrate unit has a substratebody, and a positive electrode trace and a negative electrode tracerespectively formed on the substrate body;

arranging a plurality of LED chips on the substrate body via a matrixmethod to form a plurality of longitudinal LED chip rows, wherein eachLED chip has a positive electrode side and a negative electrode siderespectively and electrically connected with the positive electrodetrace and the negative electrode trace of the substrate unit; and

longitudinally and respectively covering a plurality of stripped packagecolloids on the longitudinal LED chip rows via a first mold unit,wherein each stripped package colloid has a plurality of colloidcambered surfaces that form on a top surface thereof and correspond tothe LED chips.

Moreover, the method further comprise three packaging processes, whichcan be described as follows:

The first packaging process includes: transversely cutting the strippedpackage colloids along a line between each two adjacent and longitudinalLED chips to form a plurality of package colloids that are separatedfrom each other and respectively covered on the corresponding LED chips,wherein each package colloid has a colloid cambered surface formed on atop surface thereof and a colloid light-emitting surface formed in frontof the corresponding colloid cambered surface; respectively covering andfilling a frame unit on the substrate body, on the package colloids, andbetween each two adjacent package colloids via a second mold unit; andtransversely cutting the frame unit and the substrate body along a linebetween each two adjacent and longitudinal LED chips to form a pluralityof light bars, wherein each light bar has a frame layer for exposing thecolloid light-emitting surfaces of the package colloids.

The second packaging process includes: transversely cutting the strippedpackage colloids along a line between each two adjacent and longitudinalLED chips to form a plurality of package colloids that are separatedfrom each other and respectively covered on the corresponding LED chips,wherein each package colloid has a colloid cambered surface formed on atop surface thereof and a colloid light-emitting surface formed in frontof the corresponding colloid cambered surface; respectively covering andfilling a plurality of stripped frame layers on the substrate body, onthe package colloids, and between each two longitudinal and adjacentpackage colloids via a third mold unit; and transversely cutting thestripped frame layers and the substrate body along a line between eachtwo adjacent and longitudinal LED chips to form a plurality of lightbars, wherein each light bar has a plurality of frame bodies forrespectively exposing the colloid light-emitting surfaces of the packagecolloids.

A second aspect of the present invention is an LED chip packagestructure with high-efficiency light-emitting effect. The LED chippackage structure includes a substrate unit, a light-emitting unit, anda package colloid unit.

The substrate unit has a substrate body, and a positive electrode traceand a negative electrode trace respectively formed on the substratebody. The light-emitting unit has a plurality of LED chips arranged onthe substrate body. Each LED chip has a positive electrode side and anegative electrode side respectively and electrically connected with thepositive electrode trace and the negative electrode trace of thesubstrate unit. The package colloid unit has a plurality of packagecolloids respectively covered on the LED chips. Each package colloid hasa colloid cambered surface and a colloid light-emitting surfacerespectively formed on a top surface and a front surface thereof.

Moreover, the LED chip package structure further comprises two detailedstructures, as follows:

The first detailed structure includes: a frame unit that is a framelayer covered on the substrate body and disposed around whole lateralsides of each package colloid for exposing the colloid light-emittingsurfaces of the package colloids.

The second detailed structure includes: a frame unit has a plurality offrame bodies, wherein each frame body is covered on the package colloidfor exposing the light-emitting surface of each corresponding packagecolloid, and the frame bodies are separated from each other.

Therefore, because the series of light-generating areas is continuous,no dark bands are produced between each two LED chips and no light decayin the present invention. Furthermore, because the LED chips arearranged on a substrate body via an adhesive or a hot pressing method,the process for the LED chip package structure is simple and less timeis needed for the manufacturing process. Moreover, the LED chip packagestructure of the present can be used in vertical state due to thespecial hot pressing method. Hence, the LED chip package structure ofthe present invention not only has a good heat-dissipating effect, butalso can be applied to a thin casing.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary, and are intended toprovide further explanation of the invention as claimed. Otheradvantages and features of the invention will be apparent from thefollowing description, drawings and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The various objects and advantages of the present invention will be morereadily understood from the following detailed description when read inconjunction with the appended drawings, in which:

FIG. 1 is a flowchart of a first method for packaging LED chips of theprior art;

FIG. 2 is a flowchart of a second method for packaging LED chips of theprior art;

FIG. 3 is a schematic view of an LED chip package structure used togenerate lateral projected light according to the prior art;

FIG. 4 is a flowchart of a method of packaging LED chips packagestructure according to the first embodiment of present invention;

FIGS. 4 a to 4 f are perspective, schematic diagrams of a packagingprocess according to the first embodiment of present invention;

FIGS. 4A to 4F are cross-sectional diagrams of a packaging processaccording to the first embodiment of present invention;

FIG. 5 is a schematic view of LED chips electrically connected on asubstrate body via a flip-chip method;

FIG. 6 is a schematic view of FIG. 4C without package colloid;

FIG. 7 is a flowchart of a method of packaging LED chips packagestructure according to the second embodiment of present invention;

FIGS. 7 a to 7 b are perspective, schematic diagrams of a packagingprocess according to the second embodiment of present invention;

FIGS. 7A to 7B are cross-sectional diagrams of a packaging processaccording to the second embodiment of present invention;

FIG. 8 a is a perspective, schematic diagrams of a packaging processaccording to the third embodiment of present invention;

FIG. 8A is a cross-sectional diagrams of a packaging process accordingto the third embodiment of present invention; and

FIG. 9 is a schematic view of an LED chip package structure used togenerate lateral projected light according to the present invention.

DETAILED DESCRIPTION OF PREFERRED BEST MOLDS

Referring to FIGS. 4, 4 a to 4 f, and 3A to 3F, the first embodiment ofthe present invention provides a method of packaging LED chips packagestructure with high-efficiency light-emitting effect. The methodcomprises: referring to FIGS. 4 a and 4A, providing a substrate unit 1,the substrate unit having a substrate body 10, and a positive electrodetrace 11 and a negative electrode trace 12 respectively formed on thesubstrate body 10 (S100). The substrate unit 1 can be a PCB (PrintedCircuit Board), a flexible substrate, an aluminum substrate, a ceramicsubstrate, or a copper substrate. In addition, both the positiveelectrode trace 11 and the negative electrode trace 12 can be aluminumcircuits or silver circuits. The layouts of the positive electrode trace11 and the negative electrode trace 12 are determined by differentneeds.

Referring to FIGS. 4 b and 4B, the method of the first embodimentfurther comprises: arranging a plurality of LED chips 20 on thesubstrate body 10 via a matrix method to form a plurality oflongitudinal LED chip rows 2, each LED chip 20 having a positiveelectrode side 201 and a negative electrode side 202 respectively andelectrically connected with the positive electrode trace 11 and thenegative electrode trace 12 of the substrate unit 1 (S102).

In the first embodiment, the positive electrode side 201 and thenegative electrode side 202 of each LED chip 20 are respectively andelectrically connected with the positive electrode trace 11 and thenegative electrode trace 12 of the substrate unit 1 via twocorresponding leading wires W via a wire-bounding method. Moreover, eachlongitudinal LED chip row 2 is straightly arranged on the substrate body10 of the substrate unit 1. Each LED chip 20 can be a blue LED chip.

However, the above-mentioned method of electrically connecting the LEDchips should not be used to limit the present invention. For example,referring to FIG. 5, the positive electrode side 201′ and the negativeelectrode side 202′ of each LED chip 20′ respectively and electricallyconnected with the positive electrode trace 11′ and the negativeelectrode trace 12′ of the substrate unit 1′ via a plurality ofcorresponding solder balls B via a flip-chip method. Moreover, accordingto different needs, positive electrode sides and negative electrodesides of LED chips (not shown) can be electrically connected to apositive electrode trace and a negative electrode trace of a substrateunit (not shown) via parallel, serial, or parallel and serial method.

Referring to FIGS. 4 c, 4C and 6, the method of the first embodimentfurther comprises: longitudinally and respectively covering a pluralityof stripped package colloids 3 on the longitudinal LED chip rows 2 via afirst mold unit M1, each stripped package colloid 3 having a pluralityof colloid cambered surfaces 300 that form on a top surface thereof andcorrespond to the LED chips 20, and each stripped package colloid 3having a plurality colloid lateral surfaces 301 respectively formed infront of the corresponding colloid cambered surfaces 300 (S104).

The first mold unit M1 is composed of a first upper mold M11 and a firstlower mold M12 for supporting the substrate body 10. The first uppermold M11 has a plurality of first channels M110 corresponding to thelongitudinal LED chip rows 2. Each first channel M110 has a plurality ofconcave grooves G. Each concave groove G has a mold cambered surfaceG100 and a mold lateral surface G101 respectively formed on a topsurface and a front surface thereof. The mold cambered surface G100corresponds to the corresponding colloid cambered surface 300 and themold lateral surface G101 corresponds to the corresponding colloidlateral surface 301.

Each first channel M110 has a size is same as that of each strippedpackage colloid 3. Moreover, according to a user's needs, each strippedpackage colloid 3 can be a fluorescent resin that is formed by mixingsilicon and fluorescent powders, or each stripped package colloid 3 canbe a fluorescent resin that is formed by mixing epoxy and fluorescentpowders.

Finally, referring to FIGS. 4 c, 4 d, and 3D, the method of the firstembodiment further comprises: transversely cutting the stripped packagecolloids 3 along a line between each two adjacent and longitudinal LEDchips 20 to form a plurality of package colloids 30 that are separatedfrom each other and respectively covered on the corresponding LED chips20, and a top surface of each package colloid 30 being the colloidcambered surface 300 and each package colloid 30 has a colloidlight-emitting surface 302 formed in front of the corresponding colloidcambered surface 300 (S106).

Referring to FIGS. 4 e and 4E, the method of the first embodimentfurther comprises: respectively covering and filling a frame unit 4 onthe substrate body 10, on the package colloids 30, and between each twoadjacent package colloids 30 via a second mold unit M2 (S108). Moreover,the second mold unit M2 is composed of a second upper mold M21 and asecond lower mold M22 for supporting the substrate body 10. The secondupper mold M21 has a second channel M210 corresponding to the frame unit4. The second channel M210 has a height the same as that of each packagecolloid 30 and the second channel M210 has a width the same as that ofthe frame unit 4.

Finally, referring to FIGS. 4 e, 4 f, and 4F, the method of the firstembodiment further comprises: transversely cutting the frame unit 4 andthe substrate body 10 along a line between each two adjacent andlongitudinal LED chips 20 to form a plurality of light bars L1, and eachlight bar L1 having a frame layer 40 for exposing the colloidlight-emitting surfaces 302 of the package colloids 30 (S110). Moreover,the frame layer 40 can be an opaque frame layer such as a white framelayer.

Referring to FIGS. 7, 7 a to 7 b, and 7A to 7B, the second embodiment ofthe present invention provides a method of packaging LED chips packagestructure with high-efficiency light-emitting effect. Referring to FIGS.4 and 7, the steps S200 to S206 of the second embodiment are same as thesteps S100 to S106 of the first embodiment. In other words, theillustration of S200 is the same as FIGS. 4 a and 4A of the firstembodiment, the illustration of S202 is the same as FIGS. 4 b and 4B ofthe first embodiment, the illustration of S204 is the same as FIGS. 4 cand 4C of the first embodiment, and the illustration of S206 is the sameas FIGS. 4 d and 4D of the first embodiment.

After the step of S206, referring to FIGS. 7 a and 7A, the method of thesecond embodiment further comprises: respectively covering and filling aplurality of stripped frame layers 4′ on the substrate body 10, on thepackage colloids 30, and between each two longitudinal and adjacentpackage colloids 30 via a third mold unit M3 (S208).

The third mold unit M3 is composed of a third upper mold M31 and a thirdlower mold M32 for supporting the substrate body 10. The third uppermold M31 has a plurality of third channels M310 corresponding to thelongitudinal LED chip rows 2. Each third channel M310 has a height thesame as that of each corresponding package colloid 30 and each thirdchannel M310 has a width larger than that of each corresponding packagecolloid 30.

Finally, referring to FIGS. 7 a, 7 b, and 7B, the method of the secondembodiment further comprises: transversely cutting the stripped framelayers 4′ and the substrate body 10 along a line between each twoadjacent and longitudinal LED chips 20 to form a plurality of light barsL2, and each light bar L2 having a plurality of frame bodies 40′ forrespectively exposing the colloid light-emitting surfaces 302 of thepackage colloids 30 (S210). Moreover, each frame layer 40′ can be anopaque frame body such as a white frame body.

Referring to FIGS. 8 a and 8A, the third embodiment of the presentinvention provides a method of packaging LED chips package structurewith high-efficiency light-emitting effect. The difference between thethird embodiment and the first embodiment (or second embodiment) is that“transversely cutting the stripped package colloids 3 along a linebetween each two adjacent and longitudinal LED chips 20” is changed into“longitudinally cutting the stripped package colloids 3′ along a linebetween each two adjacent and transverse LED chips 20”.

The fourth mold unit M4 is composed of a fourth upper mold M41 and afourth lower mold M42 for supporting the substrate body 10. Thedifference between the fourth mold unit M4 and the first mold unit M1 isthat each fourth channel M410 has a mold cambered surface 300′ and amold light-emitting surface 302′ respectively formed on a top surfaceand a front surface thereof Hence, the stripped package colloids 3′ aretransversely covered on the longitudinal LED chips 2.

Referring to FIG. 9, when an LED chip D is used to generate lateralprojected light as a lateral light source that is applied to alight-guiding board M of a monitor of a notebook, a length 12 of a baseS2 can be increased according to heat-dissipation requirement (that isvery different from the prior art). In other words, the length 12 of thebase S2 can be increased, the LED chip D can get good heat-dissipatingeffect. Hence, the LED chip D can not be damaged easily due to overheat.

In conclusion, Therefore, because the series of light-generating areasis continuous, no dark bands are produced between each two LED chips andno light decay in the present invention. Furthermore, because the LEDchips are arranged on a substrate body via an adhesive or a hot pressingmethod, the process for the LED chip package structure is simple andless time is needed for the manufacturing process. Moreover, the LEDchip package structure of the present can be used in vertical state dueto the special hot pressing method. Hence, the LED chip packagestructure of the present invention not only has a good heat-dissipatingeffect, but also can be applied to a thin casing.

Although the present invention has been described with reference to thepreferred best molds thereof, it will be understood that the inventionis not limited to the details thereof Various substitutions andmodifications have been suggested, in the foregoing description, andothers will occur to those of ordinary skill in the art. Therefore, allsuch substitutions and modifications are intended to be embraced withinthe scope of the invention as defined in the appended claims.

1. A method of packaging LED chips package structure withhigh-efficiency light-emitting effect, comprising: providing a substrateunit, wherein the substrate unit has a substrate body, and a positiveelectrode trace and a negative electrode trace respectively formed onthe substrate body; arranging a plurality of LED chips on the substratebody via a matrix method to form a plurality of longitudinal LED chiprows, wherein each LED chip has a positive electrode side and a negativeelectrode side respectively and electrically connected with the positiveelectrode trace and the negative electrode trace of the substrate unit;and longitudinally and respectively covering a plurality of strippedpackage colloids on the longitudinal LED chip rows via a first moldunit, wherein each stripped package colloid has a plurality of colloidcambered surfaces that form on a top surface thereof and correspond tothe LED chips.
 2. The method as claimed in claim 1, wherein thesubstrate unit is a PCB (Printed Circuit Board), a flexible substrate,an aluminum substrate, a ceramic substrate, or a copper substrate. 3.The method as claimed in claim 1, wherein both the positive electrodetrace and the negative electrode trace are aluminum circuits or silvercircuits.
 4. The method as claimed in claim 1, wherein the positiveelectrode side and the negative electrode side of each LED chip arerespectively and electrically connected with the positive electrodetrace and the negative electrode trace of the substrate unit via twocorresponding leading wires via a wire-bounding method.
 5. The method asclaimed in claim 1, wherein the positive electrode side and the negativeelectrode side of each LED chip are respectively and electricallyconnected with the positive electrode trace and the negative electrodetrace of the substrate unit via a plurality of corresponding solderballs via a flip-chip method.
 6. The method as claimed in claim 1,wherein each longitudinal LED chip row is straightly arranged on thesubstrate body of the substrate unit.
 7. The method as claimed in claim1, wherein each stripped package colloid has a plurality colloid lateralsurfaces respectively formed in front of the corresponding colloidcambered surfaces.
 8. The method as claimed in claim 7, wherein thefirst mold unit is composed of a first upper mold and a first lower moldfor supporting the substrate body, and the first upper mold has aplurality of first channels corresponding to the longitudinal LED chiprows; wherein each first channel has a plurality of concave grooves,each concave groove has a mold cambered surface and a mold lateralsurface respectively formed on a top surface and a front surfacethereof, and the mold cambered surface corresponds to the correspondingcolloid cambered surface and the mold lateral surface corresponds to thecorresponding colloid lateral surface; wherein each first channel has asize is same as that of each stripped package colloid.
 9. The method asclaimed in claim 1, wherein each stripped package colloid is afluorescent resin that is formed by mixing silicon and fluorescentpowders.
 10. The method as claimed in claim 1, wherein each strippedpackage colloid is a fluorescent resin that is formed by mixing epoxyand fluorescent powders.
 11. The method as claimed in claim 1, furthercomprising: transversely cutting the stripped package colloids along aline between each two adjacent and longitudinal LED chips to form aplurality of package colloids that are separated from each other andrespectively covered on the corresponding LED chips, wherein a topsurface of each package colloid is the colloid cambered surface and eachpackage colloid has a colloid light-emitting surface formed in front ofthe corresponding colloid cambered surface; respectively covering andfilling a frame unit on the substrate body, on the package colloids, andbetween each two adjacent package colloids via a second mold unit; andtransversely cutting the frame unit and the substrate body along a linebetween each two adjacent and longitudinal LED chips to form a pluralityof light bars, wherein each light bar has a frame layer for exposing thecolloid light-emitting surfaces of the package colloids.
 12. The methodas claimed in claim 11, wherein the second mold unit is composed of asecond upper mold and a second lower mold for supporting the substratebody, the second upper mold has a second channel corresponding to theframe unit, and the second channel has a height the same as that of eachpackage colloid and the second channel has a width the same as that ofthe frame unit.
 13. The method as claimed in claim 11, wherein the framelayer is an opaque frame layer.
 14. The method as claimed in claim 13,wherein the opaque frame layer is a white frame layer.
 15. The method asclaimed in claim 1, further comprising: transversely cutting thestripped package colloids along a line between each two adjacent andlongitudinal LED chips to form a plurality of package colloids that areseparated from each other and respectively covered on the correspondingLED chips, wherein a top surface of each package colloid is the colloidcambered surface and each package colloid has a colloid light-emittingsurface formed in front of the corresponding colloid cambered surface;respectively covering and filling a plurality of stripped frame layerson the substrate body, on the package colloids, and between each twolongitudinal and adjacent package colloids via a third mold unit; andtransversely cutting the stripped frame layers and the substrate bodyalong a line between each two adjacent and longitudinal LED chips toform a plurality of light bars, wherein each light bar has a pluralityof frame bodies for respectively exposing the colloid light-emittingsurfaces of the package colloids.
 16. The method as claimed in claim 15,wherein the third mold unit is composed of a third upper mold and athird lower mold for supporting the substrate body, the third upper moldhas a plurality of third channels corresponding to the longitudinal LEDchip rows, and each third channel has a height the same as that of eachcorresponding package colloid and each third channel has a width largerthan that of each corresponding package colloid.
 17. The method asclaimed in claim 15, wherein each frame body is an opaque frame body.18. The method as claimed in claim 17, wherein the opaque frame body isa white frame body.
 19. The method as claimed in claim 1, wherein thefirst mold unit is composed of a first upper mold and a first lower moldfor supporting the substrate body, the first upper mold has a pluralityof first channels corresponding to the longitudinal LED chip rows;wherein each first channel has a mold cambered surface and a moldlateral surface respectively formed on a top surface and a front surfacethereof, and each first channel has a height and a width the same asthose of each stripped package colloid.
 20. The method as claimed inclaim 19, further comprising: longitudinally cutting the strippedpackage colloids along a line between each two adjacent and transverseLED chips to form a plurality of package colloids that are separatedfrom each other and respectively covered on the corresponding LED chips,wherein each package colloid has a colloid cambered surface formed on atop surface thereof and a colloid light-emitting surface formed in frontof the corresponding colloid cambered surface; respectively covering andfilling a frame unit on the substrate body, on the package colloids, andbetween each two adjacent package colloids via a second mold unit; andtransversely cutting the frame unit and the substrate body along a linebetween each two adjacent and longitudinal LED chips to form a pluralityof light bars, wherein each light bar has a frame layer for exposing thecolloid light-emitting surfaces of the package colloids.
 21. The methodas claimed in claim 20, wherein the second mold unit is composed of asecond upper mold and a second lower mold for supporting the substratebody, the second upper mold has a second channel corresponding to theframe unit, and the second channel has a height the same as that of eachpackage colloid and the second channel has a width the same as that ofthe frame unit.
 22. The method as claimed in claim 19, furthercomprising: longitudinally cutting the stripped package colloids along aline between each two adjacent and transverse LED chips to form aplurality of package colloids that are separated from each other andrespectively covered on the corresponding LED chips, wherein eachpackage colloid has a colloid cambered surface formed on a top surfacethereof and a colloid light-emitting surface formed in front of thecorresponding colloid cambered surface; respectively covering andfilling a plurality of stripped frame layers on the substrate body, onthe package colloids, and between each two longitudinal and adjacentpackage colloids via a third mold unit; and transversely cutting thestripped frame layers and the substrate body along a line between eachtwo adjacent and longitudinal LED chips to form a plurality of lightbars, wherein each light bar has a plurality of frame bodies forrespectively exposing the colloid light-emitting surfaces of the packagecolloids.
 23. The method as claimed in claim 22, wherein the third moldunit is composed of a third upper mold and a third lower mold forsupporting the substrate body, the third upper mold has a plurality ofthird channels corresponding to the longitudinal LED chip rows, and eachthird channel has a height the same as that of each correspondingpackage colloid and each third channel has a width larger than that ofeach corresponding package colloid.